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Features of silic鐘業on wafer diffusion surface cleaning日木 sandblasting machine:
1. The spray gun p微現osition frame is pr離我ovided, and the angle a對妹nd distance of t商商he spray gun can be adj湖好usted according to the product proce能火ss requirements;
2. The high wear-resi一離stant boron car影站bide nozzle is adopted, an愛腦d the number of spray guns is desi日開gned to be 8. T視討he upper and lower groups愛答 of spray guns aim at both s著船ides of the silicon wafer for sand樂樂 blasting at the same time, with an制藍 efficiency of 農市about 12-30m/min, f間一ast processing speed and high ef我費ficiency;
3. The utility model又影 can eliminate th我都e static electri銀朋city on the surface of t制資he silicon wafer and a好車chieve the cleaning effect.
Scope of application of silico關南n wafer diffusion surface cl爸習eaning sandblast內拍ing machine:
Remove burrs and b可黑urrs on the surface of sili說有con wafer.
